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ILX569K
5340-pixel x 6 line CCD Linear Sensor (Color)
Description The ILX569K is a reduction type CCD linear sensor developed for color image scanner. This sensor reads A4-size documents at a density of 600 DPI and 1200 DPI. Sensor Line Features * Number of effective pixels: 32040 pixels (5340 pixels x 6) * Pixel size: 4m x 4m (4m pitch) * Distance between main line: 48m (12 lines) * Distance between main line and sub line: 8m (2 lines) Common Features * Single-sided readout * Ultra low lag * Single 12V power supply * Maximum data rate: 8MHz/Color * Input clock pulse: CMOS 5V drive * Number of output: 3 (R, G, B) * Package: 22 pin Plastic-DIP (400mil) Absolute Maximum Ratings * Supply voltage VDD * Operating temperature Pin Configuration (Top View)
L1 3 VDD VOUT-R VOUT-B NC NC NC NC 1
1 1 1 1 1 1
22 pin DIP (Plastic)
15 -10 to +55
V C
Sensor Configuration
1 22 L2 21 4 20 RS 19 GND 1 2 2
3 4
5 6
7 8
Blue Blue 48m
2 3 4
G (main) R (main) B (main)
5
R (sub)
18 VOUT-G 17 NC 16 NC 15 1 14 2 13 ROG-B 12 NC 4m 4m 4m
3 4
5 6
7 8
Green Green 48m
G (sub)
6 7 8 9
B (sub)
5340
5340
5340
5340
5340
ROG-R 11
5340
ROG-G 10
1 2
3 4
5 6
7 8
Red 8m Red
4m Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
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E01750A27
Block Diagram
VDD 3
2 14
CCD Register
D31 D74 S1 S2 S3
Readout Gate
S5340
D75
Main Line (Blue) Sub Line (Blue)
VOUT-B
D74' S1'
D31'
D75'
D106'
S5340'
5
S2'
S3'
D106
CCD Register CCD Register
D31 D74 S1 S2 S3
Readout Gate Readout Gate
S5340
Driver
13 ROG-B
D75
Main Line (Green)
VOUT-G 18
D74' S1' D31'
Sub Line (Green)
D75'
D106'
S5340'
S2'
S3'
D106
D31
D74 S1
S5340
D75
Main Line (Red) Sub Line (Red)
VOUT-R
4
D74' S1' D31' D75'
D106'
S5340'
S2'
S3'
D106
S2
S3
-2-
CCD Register CCD Register
Readout Gate Readout Gate
Driver
10 ROG-G
CCD Register
Readout Gate
Driver
11 ROG-R
20 RS
2
21
1
22
19 GND
15 1
3 4 L1 L2
ILX569K
ILX569K
Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 Symbol L1 3 VDD VOUT-R VOUT-B NC NC NC NC ROG-G ROG-R Description Clock pulse input Clock pulse input 12V power supply Signal output (red) Signal output (blue) NC NC NC NC Clock pulse input Clock pulse input Pin No. 12 13 14 15 16 17 18 19 20 21 22 Symbol NC ROG-B 2 1 NC NC VOUT-G GND RS 4 L2 NC Clock pulse input Clock pulse input Clock pulse input NC NC Signal output (green) GND Clock pulse input Clock pulse input Clock pulse input Description
Recommended Supply Voltage Item VDD Min. 11.4 Typ. 12 Max. 12.6 Unit V
Clock Characteristics Item Input capacity of 1, 2 Input capacity of RS Input capacity of ROG Input capacity of 3, 4, L1, L2 Symbol C1, C2 CRS CROG CL1, CL2, C3, C4 Min. -- -- -- -- Typ. 1500 10 10 20 Max. -- -- -- -- Unit pF pF pF pF
Clock Frequency Item 1, 2, L1, L2 3, 4, RS Symbol f1, f2, fL1, fL2 f3, f4, fRS Min. -- -- Typ. 0.5 1 Max. 8 8 Unit MHz MHz
Input Clock Pulse Voltage Condition Item 1, 2, RS, ROG, L1, L2, 3, 4 pulse voltage High level Low level -3- Min. 4.75 -- Typ. 5.0 0 Max. 5.25 0.1 Unit V V
ILX569K
Electrooptical Characteristics (Note 1) (Ta = 25C, VDD = 12V, fRS = 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm)) Item Red Sensitivity Sensitivity nonuniformity Saturation output voltage Red Saturation exposure Dark voltage average Dark signal nonuniformity Image lag Supply current Total transfer efficiency Output impedance Offset level Green Blue Green Blue Symbol RR RG RB PRNU VSAT SER SEG SEB VDRK DSNU IL IVDD TTE ZO VOS Min. 1.3 1.2 0.8 -- 1.8 -- -- -- -- -- -- -- 92 -- -- Typ. 1.8 1.7 1.2 4 2.0 1 1 1.64 0.1 0.5 0.02 30 98 360 5.7 Max. 2.3 2.2 1.6 20 -- -- -- -- 1.6 3.2 -- 45 -- -- -- mV mV % mA % V Note 9 Note 6 Note 7 Note 8 lx * s Note 5 % V Note 3 Note 4 V/(lx * s) Note 2 Unit Remarks
Notes: 1. In accordance with the given electrooptical characteristics, the black level of 1200 DPI is defined as the average value of D32, D33 to D73. 2. For the sensitivity test light is applied with a uniform intensity of illumination. 3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT = 500mV (typ.) PRNU = (VMAX - VMIN)/2 x 100 [%] VAVE
4. Use below the minimum value of the saturation output voltage. 5. Saturation exposure is defined as follows. SE = VSAT R
6. 7. 8. 9.
Where R indicates RR, RG, RB and SE indicates SER, SEG, SEB. Optical signal accumulated time int stands at 4ms. VOUT-G = 500mV (typ.) Supply current means the total current of this device. Vos is defined as indicated bellow. VOUT indicates VOUT-R, VOUT-G, and VOUT-B.
VOUT
VOS GND
-4-
Clock Timing Chart 1
1200 DPI
ROG 1, L1
5 0
1
5 0 5 0
2, L2
1
2
2 3 4
3
5 0
4
5 0
S5339'
S5340'
S5340
VOUT
Optical black (42 pixels x 2) Dummy signal (74 pixels x 2) Effective pixels signal (5340 pixels x 2) 1-line output period (5446 pixels x 2) Dummy signal (32 pixels x 2)
Note) The transfer pulses (1, 2) must have more than 5446 cycles. The transfer pulses (3, 4) must have more than 10892 cycles. VOUT indicates VOUT-R, VOUT-G, VOUT-B.
D106'
D31'
D32'
D74'
D75'
D78'
D79'
D80'
D81'
D82'
D31
D32
D74
D75
D79
D80
D81
D82
D1'
S1'
D1
D2
S1
-5-
RS
5 0
ILX569K
Clock Timing Chart 2
600 DPI
ROG
5 0
3
1, 3
5 0 5 0 5 0
2, 4, L2
RS
L1
0V S10679 S10680
1
2
4
D42
D43
D44
D83
D84
D85
D86
VOUT Optical black (42 pixels) Dummy signal (85 pixels) Effective pixels signal (5340 pixels) 1-line output period (5505 pixels) Dummy signal (more than 80 clocks)
Note) The transfer pulses (1, 2) must have more than 5505 cycles. VOUT indicates VOUT-R, VOUT-G, VOUT-B.
D87
D1
D2
D3
S1
S2
-6-
ILX569K
ILX569K
Clock Timing Chart 3
t4
t5
ROG t6 1 2 t7 t6 t1 t2 t7 t3
ClockTiming Chart 4
t7 1 t6 2 t9 L1 t8 L2
t6
t7
t8
t9
t15 t11 3 t10
4 t10 t16 RS t17 VOUT Sub Line t14 t18 Main Line t11 t12 t13
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ILX569K
Clock Pulse Recommended Timing Item ROG, 1 pulse timing ROG pulse high level period ROG pulse high level period ROG pulse rise time ROG pulse fall time 1 pulse rise time/2 pulse fall time 1 pulse fall time/2 pulse rise time L1 pulse rise time/L2 pulse fall time L1 pulse fall time/L2 pulse rise time 3 pulse rise time/4 pulse fall time 3 pulse fall time/4 pulse rise time RS pulse rise time RS pulse fall time RS pulse high level period L1, L2 and 3 pulse timing RS, 3 pulse timing Signal output delay time Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 t18 Min. 50 5000 1200 0 0 0 0 0 0 0 0 0 0 60 0 60 -- -- Typ. 100 6000 1500 5 5 50 50 10 10 10 10 10 10 1201 10 2501 40 20 Max. -- -- -- 10 10 80 80 30 30 30 30 30 30 -- -- -- -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
1 These timing data is the recommended condition under fRS = 1MHz.
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ILX569K
Application Circuit1

L2 IC2 100 2
4
RS Tr1 VOUT-G 100
1
2
ROG-B
IC1 100 3k 2
IC1
2 14 13
100 12
22
21
20
19
18
17
16
15
GND
RS
NC
NC
1
2
VOUT-G
ROG-G
ROG-B
L2
VDD
L1
12V
3
1
2
3
4
5
6
7
8
9
10 100
ROG-R
11 100 IC2 IC1: 74HC04 x 3pcs IC2: 74HC04 Tr1: 2SA1175
VOUT-R
VOUT-B
NC
NC
0.1F
47F/ 16V 100
3k 2 VOUT-R Tr1 100 3k VOUT-B 100
IC2 L1 3
NC
NC
ROG-G ROG-R
Tr1
1 Data rate fRS = 1MHz
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
-9-
NC
4
ILX569K
Example of Representative Characteristics
Spectral sensitivity characteristics (Standard characteristics)
1.0 R 0.9 0.8 0.7
Relative sensitivity
G B
0.6 0.5 0.4 0.3 0.2 0.1 0 400
500
600
700 Wavelength [nm]
800
900
1000
- 10 -
ILX569K
Notes on Handling 1. Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensors. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2. Notes on handling CCD packages The following points should be observed when handling and installing packages. a) Remain within the following limits when applying a static load to the package. (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm
Cover glass Plastic portion 39N 29N 29N 0.9Nm
Ceramic portion
(1)
Adhesive
(2)
(3)
(4)
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the packege to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5) Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. 3. Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnance causes damage to the glass and other defects. Use a grounded 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero-cross type. - 11 -
ILX569K
4. Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5. Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6. CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
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Package Outline
Unit: mm
22pin DIP (400mil)
32.0 0.3
6.2 0.3 22
21.360 (5340Pixels) 12
10.0 0.3
5.0 0.3
V No.1Pixel (Blue Main) H 1 ( 2.9 ) 11
10.16
4.0 0.5
2.1
2.8 0.5
2.54
0.51
1. The height from the bottom to the sensor surface is 1.61 0.3mm. 2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.
PACKAGE STRUCTURE
PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS DRAWING NUMBER
Sony Corporation
0.3
M
Plastic,Ceramic GOLD PLATING 42 ALLOY 2.21g LS-D18(E)
ILX569K
0.25
0 to 9
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